This page focuses on the four capability areas that separate FQC from commodity PCB fabs.
High layer count, process stability, fine-line density, and high-speed / high-frequency builds.
50-layer builds with an 80L / 100L roadmap for demanding multilayer programs.
IATF, ISO 13485, lot coupons, cross-section checks, and change control.
35 / 35 um line-space with laser microvia and HDI build-up capability.
High-speed materials, controlled impedance, and 40 GHz class SI positioning.
High-layer multilayer product - FQC
HIGH LAYER COUNT
For engineers, layer count is not just a marketing number. It means the fab can keep registration, press-cycle stability, hole reliability, and impedance control under control as the stack grows.
FQC's disclosed product examples include 50-layer multilayer builds, while the Thailand technical table lists 80 layers for 2026 and 100 layers for 2027 planning. That gives buyers a credible path from demanding multilayer programs into future ultra-high-layer designs.
Best fit: AI server boards, ATE / test-interface boards, dense industrial control hardware, and high-pin-count systems where routing escape and power integrity push beyond standard multilayer capability.
Max layer count
50L proven; 80L / 100L roadmap
Aspect ratio
25:1 now; 30:1 target
Impedance tolerance
±7% now; ±5% target
Layer-to-layer registration
0.05 mm now; 0.035 mm target
PPT capability table: 80L in 2026 planning, 100L in 2027 planning; product examples include 50L multilayer cross sections.
Reliability inspection and process control - FQC
PROCESS STABILITY
High-reliability PCB work is won in process control: material traceability, change-point discipline, coupon testing, cross-section analysis, and repeatable plating / lamination behavior from lot to lot.
The Thailand profile calls out IATF 16949, ISO 13485, QC080000, 4M1E change-point management, lot guarantee testing, shipment coupons, and long-term retained samples. That matters to engineers building automotive, medical, industrial, and instrumentation programs.
Best fit: long-life industrial electronics, automotive control boards, medical instrumentation, safety-related assemblies, and products where one lot excursion creates field-service cost.
Quality systems
IATF 16949 / ISO 13485 / QC080000
Change control
4M1E + 3H change-point management
Lot testing
Thermal shock + cross-section
Traceability
Shipment coupon + retained sample
Lot coupon testing includes thermal shock cycling and cross-section checks; retained samples support traceability programs.
Fine-line HDI product - FQC
HIGH-DENSITY ROUTING
High density is where many standard fabs lose manufacturability. Fine traces, tight spacing, small laser vias, and repeated lamination cycles leave very little room for registration drift.
The PPT lists minimum inner / outer line and space at 0.035 / 0.035 mm for 2026, with a 0.025 / 0.025 mm 2027 target. It also lists HDI builds up to 4+N+4 in 2026 and 5+N+5 in 2027, with laser vias down to 0.075 mm and a 0.05 mm target.
Best fit: high-density BGA escape, optical modules, compact industrial controllers, AI accelerator carriers, and layouts where board area is constrained but I/O count keeps rising.
Line / space
35 / 35 um now; 25 / 25 um target
Min laser via
0.075 mm now; 0.05 mm target
Build-up order
4+N+4 now; 5+N+5 target
Pattern accuracy
±0.05 mm now; ±0.035 mm target
2026: 35 / 35 um L/S and 0.075 mm laser via; 2027 target: 25 / 25 um L/S and 0.05 mm laser via.
High-speed low-loss PCB - FQC
HIGH-SPEED / HIGH-FREQUENCY
High-speed boards need more than a low-loss material name on a quotation. The fab has to control impedance, copper roughness, dielectric thickness, registration, and via structures through the production flow.
FQC's materials and process base includes high-speed laminates such as Panasonic, Rogers, Isola, TUC, and related PCB material systems. The equipment list also includes network-analyzer capability, while existing case-study content references 40 GHz optical-module signal integrity.
Best fit: 800G / 1.6T optical modules, high-speed server interconnects, 5G / RF boards, automotive radar-related builds, and designs where insertion loss and impedance variation drive pass / fail.
Tolerance
±7% now; ±5% target
Max frequency
40 GHz class
Qualified materials
Panasonic / Rogers / Isola / TUC
Target application
800G / 1.6T optical, RF, server
40 GHz class signal-integrity positioning, ±7% impedance in 2026 planning and ±5% in 2027 planning.
Every surface finish processed in-house in our Rayong, Thailand facility. No subcontracting. No quality handoff. No lead-time slippage.
Each process — chemistry, spec window, applications, trade-offs. All run under one roof, one QMS.
Tin-Nickel-Copper lead-free alloy
Tin-Silver-Copper SAC alloy
Electroless Nickel Immersion Gold · Ni-P (4-7 μm) + Au (0.05-0.15 μm)
Electroless Ni (3-6μm) + Pd (0.05-0.3μm) + Au (0.03-0.1μm)
Pure gold plating (99.9%+)
Gold + Cobalt or Nickel hardener
Pure tin immersion deposit
Benzimidazole / Benzotriazole organic film
Pure silver immersion deposit
Capability installation April 2026 · Production qualification Q2 2026
Bare-CCL through ship-out. Double-layer and multi-layer / HDI routes share the surface-finish bay — one line, all stackups.
The cost of owning the finishing lines vs. routing panels to a vendor-of-vendor.
No transit between subcontractors. Direct process handoff saves 3–5 days per order.
Every finish qualified under our own IATF 16949 QMS — no external QC-basis gap.
Switch finish type mid-order. Adjust thickness spec on short notice.
Single-facility lot genealogy from bare CCL through final finish.
NEXT STEP
Talk to an engineer, or send Gerbers for a DFM review.